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    • 专利摘要:
    ENERGY SAVING TO DETECT HOT PLUG. Energy saving for hot plug detection (HPD) is revealed. In a particular embodiment, a method includes detecting, on a source device that is connected to a heatsink device, a connection from the source device to the heatsink device, through a connector. The source device includes a DC voltage source, and the connection is detected without consuming power from the DC voltage source.
    公开号:BR112012007906B1
    申请号:R112012007906-9
    申请日:2010-10-07
    公开日:2020-10-13
    发明作者:Cheng Zhong；Nam V. Dang；Hung Q. Vuong；Xiaohua Kong
    申请人:Qualcomm Incorporated；
    IPC主号:
    专利说明:

    Field of the Invention
    [001] The present disclosure is, in general, related to power savings for hot-plug detection. Description of the Prior Art
    [002] Advances in technology have resulted in smaller and more powerful computing devices. For example, today, there are a variety of portable personal computing devices, including wireless computing devices, such as portable cordless phones, personal digital assistants (PDAs), and paging devices, which are small, light and easily carried by users. . More specifically, portable cordless phones, such as cell phones and Internet Protocol (IP) phones, can communicate voice and data packets over wireless networks. In addition, many cordless phones include other types of devices, which are incorporated here. For example, a cordless phone can also include a digital photo camera, a digital video camera, a digital recorder and an audio file player. In addition, such cordless phones can process executable instructions, including software applications, such as a web browser application, which can be used to access the Internet. As such, these cordless phones can include significant computing capabilities.
    [003] Cordless phones may also include multimedia features, such as audio and / or video input (A / V) and A / V output. Popular A / V interfaces for standalone devices, such as digital versatile disc players (DVD) and Blu-ray disc players (BD), include high definition video interface (HDMI) and digital visual interface (DVI). One consideration when incorporating these interfaces into cordless phones is the power consumption required by the interfaces. For example, HDMI and DVI specifications require devices to support hot plug (HPD) detection, a feature that allows you to detect a connection to another HDMI or DVI compatible device. The HDMI and DVI specifications additionally require that, to support HPD, devices include a +5 volt direct current (DC) power source that remains active. However, maintaining the + 5V DC power supply can shorten the battery life of cordless phones that attempt to incorporate HDMI or DVI. Summary of the Invention
    [004] Power saving systems and methods for hot plug detection are disclosed. A receiver's sense circuit and a controller are added to a source device (for example, an HDMI enabled cordless phone). When enabled, the receiver perception circuit detects a connection from a heatsink device (for example, an HDTV compatible display device) to the source device, via a connector (for example, an HDMI cable), via pins (e.g., HDMI clock pins or red, green, or blue HDMI data pins) from the connector. When the receiver perception circuit detects the connection, the controller enables a DC voltage source in the source device and receives an HPD signal. In response to receiving the HPD signal, the controller disables the receiver perception circuit and enables multimedia output via an output device trigger. When the connector is disconnected either from the source device or the heatsink device, the controller detects an absence of the HPD signal. In response, the controller disables the DC voltage source.
    [005] In a particular embodiment, a method is described, which includes detecting, in a source device, connectable to a dissipating device, a connection from the source device to the dissipating device, through a connector. The source device includes a DC voltage source, and the connection is detected without consuming power from the DC voltage source.
    [006] In another particular embodiment, an electronic device includes a DC voltage source, coupled to a DC interface. The electronic device also includes a receiver perception circuit, configured to detect a connection from the electronic device to a dissipating device, through a connector, without consuming power from the DC voltage source. The electronic device also includes a controller coupled to an HPD interface. The controller is configured to receive a detection signal from the receiver's perception circuit. The controller is also configured to selectively control a switch to enable or disable the DC voltage source, based on the detection signal. The controller is additionally configured to detect an HPD signal on the HPD interface, after enabling the DC voltage source, and to disable the receiver perception circuit, in response to detecting the HPD signal. The controller is configured to detect an absence of the HPD signal and to enable the receiver perception circuit in response to detecting the absence of the HPD signal.
    [007] A special advantage provided by at least one of the revealed modalities is an ability to withstand HPD without continuously draining a battery due to a bias current from a + 5V DC power supply. Another particular advantage provided by at least one of the disclosed modalities is an elimination of a drain battery polarization current in a device that supports HPD, when the device is in an inactive state, a rest state, an out state (HD) not high definition or another state in which an HDMI interface is down.
    [008] Other aspects, advantages and characteristics of the present disclosure will become evident after reviewing the entire application, including the following sections: Brief Description of the Drawings, Detailed Description of the Invention and the Claims. Brief Description of Drawings
    [009] Figure 1 is a block diagram of a particular illustrative modality of a power saving system for HPD;
    [0010] Figure 2 is a circuit diagram of a particular illustrative embodiment of the receiver perception circuit, of the system of figure 1;
    [0011] Figure 3 is a flow diagram of a particular illustrative embodiment of a power saving method for HPD;
    [0012] Figure 4 is a diagram to illustrate a particular illustrative embodiment of a state diagram, to implement power saving for HPD to a source device;
    [0013] Figure 5 is a block diagram of a wireless device, including power savings for HPD; and
    [0014] Figure 6 is a diagram to illustrate a particular modality of an electronic device manufacturing process. Detailed Description of the Invention
    [0015] Referring to figure 1, a particular illustrative modality of a power saving system for hot plug detection (HPD) is disclosed and generally designated 100. The system includes a source device 110, connected to a heatsink device 130, through a connector 120. In an illustrative embodiment, connector 120 is a high definition multimedia interface cable (HDMI) or a digital visual interface cable (DVI).
    [0016] The source device 110 includes a voltage source DC 112, coupled to a power supply pin 121 of the connector. In a particular embodiment, the DC voltage source 112 produces a DC voltage of approximately 5 volts. For example, connector 120 can be an HDMI cable, and DC voltage source 112 can be attached to the eighteen pin of the HDMI cable (referred to as a + 5V power pin by the HDMI specification). As another example, the connector 120 can be a DVI cable, and the DC voltage source 112 can be coupled to the fourteen pin of the DVI cable (designated as a + 5V power pin by the DVI specification). The HDMI specification can be found at www.hdmi.org, and the DVI specification can be found at www.ddwg.org.
    [0017] The source device 110 also includes a controller 114 attached to an HPD 122 pin of connector 120. For example, connector 120 can be an HDMI cable, and controller 114 can be attached to nineteen pin of the HDMI cable ( designated as an HPD pin by the HDMI specification). As another example, connector 120 can be a DVI cable, and the controller can be attached to the sixteen pin of the DVI cable (referred to as an HPD pin by the DVI specification). The controller 114 is configured to selectively turn the DC voltage source 112 on and off, via a DC voltage source enable signal 111, in response to a detection signal 113, received from a receiver perception circuit ( RX) 116. For example, controller 114 can control a switch that enables or disables a connection to the DC 112 voltage source. The controller is also configured to selectively enable and disable the RX 116 sense circuit, via a perception enable RX 115, in response to an HPD signal received from HPD pin 122. Controller 114 is additionally configured to enable data transfer from an output driver 118 of the source device 110, via a data transfer enable signal 117 in response to detecting the HPD signal from the HPD pin 122.
    [0018] The source device 110 still includes the sense circuit RX 116, which is configured to detect a connection between the source device 110 and the heatsink device 130, through connector 120. The sense circuit RX 116 detects the connection without consuming power from the DC 112 voltage source. In a particular mode, the RX 116 sense circuit detects the connection, based on signals received from a Clock pin + 123 and a Clock pin-124 from connector 120 For example, connector 120 can be an HDMI cable, and the RX 116 sense circuit can detect the connection, based on signals received from pin 10 (designated by the HDMI specification as a Clock + pin with minimized differential signaling (TMDS) and pin 12 (designated by the HDMI specification as a TMDS- Clock pin). As another example, connector 120 can be a DVI cable, and the RX 116 sense circuit can detect the connection, based on signals received from pin 23 (designated by the DVI specification as a TMDS Clock pin) and pin 24 (designated by the DVI specification as a TMDS-Watch pin).
    [0019] It should be noted that, although the particular mode illustrated in figure 1 shows the sense circuit RX 116 coupled to the clock pins 123-124, the sense circuit RX 116 can alternatively be coupled to, and detect the connection via, a Data pin + 125 and a Data pin 126. For example, data pins 125-126 can be Data +/- Red pins from TMDS (pins 1/3 of an HDMI cable or pins 2 / 1 or 5/4 of a DVI cable), Data pins +/- Green of TMDS (pins 4/6 of an HDMI cable or pins 10/9 or 13/12 of a DVI cable) or Data pins +/- Blue of TMDS (pins 7/9 of an HDMI cable or pins 18/17 or 21/20 of a DVI cable).
    [0020] The sense circuit RX 116 is configured to transmit the detection signal 113 to the controller 114, which indicates whether the connection between the source device 110 and the heatsink device 130, via connector 120, is detected or not. The sense circuit RX 116 is also configured to be selectively enabled and disabled by controller 114 via the perception enable signal RX 115.
    [0021] Output trigger 118, in source device 110, can be selectively enabled and disabled by controller 114, through the data transfer enable signal 117. In an illustrative mode, output trigger 118, when enabled, issues a video signal from the source device 110 to the heatsink device 130, via data pins (for example, Data pins + 125 and Data pins 126) of the connector. For example, output driver 118 can transmit high definition video to the heatsink device 130, through data pins 125-126.
    [0022] Although connector 120 is illustrated in figure 1 as having only six pins 121-126, connector 120 can have any number of pins. For example, when connector 120 is an HDMI cable, connector 120 can have at least nineteen pins. As another example, when connector 120 is a DVI cable, connector 120 can have up to twenty-four digital pins and five analog pins.
    [0023] The heatsink device 130 includes a resistor R 132 and a power supply of heatsink device 134. In a particular embodiment, the resistor R 132 is an IkQ resistor that circulates a signal received from a power supply pin 121 from connector 120 to HPD pin 122 of connector 120. Thus, when voltage source DC 112, on source device 110, is active, a 5 V signal is received at resistor R 132 and transmitted back to the controller 114, through the HPD pin 122 of the connector 120, as the HPD signal. Thus, the heatsink device 130 may include a circuit to transmit the HPD signal to the source device 110, in response to receiving the + 5V DC voltage from the source device 110. In a particular embodiment, the power supply Heatsink device 134 is a 3, 3V power supply, connected to the clock pin + 123 and clock pin 124 of connector 120, via two 50Ω 136 and 138 resistors, respectively. Thus, when the source device 110 is connected to the heatsink device 130, via connector 120, the sense circuit RX 116 can receive a signal through the clock pin + 123 and the clock pin 124 of connector 120, even when the DC voltage source 112 is turned off and no HPD signal is received at controller 114.
    [0024] In operation, the source device 110 can implement power savings for HPD, as follows. Initially, the source device 110 and the heatsink device 130 can be disconnected, the DC voltage source 112 can be turned off, and the sense circuit RX 116 can be enabled. Alternatively, the RX 116 sense circuit can initially be disabled and selectively enabled by controller 114, in response to an application enabling that uses the high definition output capability of output driver 118 (for example, an application HDTV). Since devices 110, 130 are connected via connector 120 (for example, an HDMI cable or DVI cable), the sense circuit RX 116 can detect the connection between devices 110, 130 through connector 120, based on on signals received from clock pins 123-124 or data pins 125-126 of connector 120. It should be noted that when the sense circuit RX 116 detects the connection, the voltage source DC 112 is still switched off . Upon detecting the connection, the RX 116 sense circuit can notify the controller 114 of the detected connection via the detection signal 113.
    [0025] In response, controller 114 can enable DC voltage source 112, coupled to power voltage pin 121, from connector 120 and receive an HDD signal from HDD pin 122 on connector 120. Controller 114 also can disable the RX 116 sense circuit via the RX 115 perception enable signal in an effort to save power, because the RX 116 sense circuit may not be necessary, since the HPD signal is received by the controller 114 In response to receiving the HPD signal, controller 114 can also allow output to output trigger 118, via data transfer enable signal 117. The source device 110 (for example, a cordless phone equipped with HDMI or equipped with DVI) can then transmit A / V signals to the heatsink device 130 (for example, an HDTV display), via connector 120.
    [0026] When source device 110 and heatsink device 130 are no longer connected via connector 120 (for example, because connector 120 has been "unplugged" from one of devices 110, 130), controller 114 does not receive plus the HPD signal on the HPD pin 122 of connector 120. In response to detecting the absence of the HPD signal, controller 114 can return the source device 110 to its initial state. That is, the controller 114 can switch off the DC voltage source 112, via signal 111, disable output driver 118, via signal 117, and rehabilitate the sense circuit RX 116, via signal 115, so that the sense circuit RX 116 can detect a subsequent connection to the heatsink device 130 or any other heatsink device.
    [0027] It should be noted that during normal operation of the source device 110 (that is, when the output driver 118 emits A / V output signals), the RX 116 sense circuit is disabled. Thus, the RX 116 sense circuit may not consume power during normal operation of the source device 110. A small current (for example, approximately 150pA) may travel through the RX 116 sense circuit for a short time between the heatsink device 130 being connected and the controller 114 which disables the sense circuit RX 116, in response to detecting the presence of the HPD signal. It should also be noted that, in a particular embodiment, controller 114 can be implemented as software (for example, firmware) on the source device 110, configured to receive, send and process digital signals (for example, signals 111, 113, 115, 117, the HPD signal, signals from clock pins 123-124 and signals from data pins 125-126).
    [0028] It will be appreciated that the system 100 in figure 1 can support HPD, as required by the HDMI and DVI specifications, while reducing current drain from the DC voltage source on the source device. Therefore, system 100 in figure 1 can reduce or eliminate the bias current from the DC voltage source when the source device is in an idle mode, a standby mode, a non-HD output mode, a power saving state to conserve battery life or any combination of these. It will be appreciated, therefore, that the system 100 of figure 1 can enable battery life saving in portable devices, such as cordless phones.
    [0029] Referring to figure 2, a circuit diagram of a particular illustrative embodiment of the sense circuit RX 116 of figure 1 is represented and generally designated 200. The sense circuit RX 200 is coupled to a sink device circuit 230 and receives two signals 241-242 from the heatsink circuit 230. In an illustrative embodiment, the heatsink circuit 230 is a technique of the heatsink device 130 of Figure 1, and signals 241-242 are received through a connector , such as the connector 120 of figure 1.
    [0030] The sense circuit RX 200 receives an enabling signal of sense RX 225, as a control signal for a PEET M2 214 transistor and for an NFET M3 216 transistor. In an illustrative mode, the perception enable signal RX 225 is the perception enable signal RX 115 of figure 1, received from a controller, such as controller 114 of figure 1 (for example, in response to an enabling of an HDTV application). The RX 200 sense circuit also includes two resistors RI 202 and 204, which couple signals 241-242 to a resistor R2 206. Resistor R2 206 is connected to the input of an NFET transistor M1 212, which receives a control signal through of an IkQ 208 resistor. The outputs from transistors 212 Ml and M2 214 are applied to a resistor R3 210, which is connected to the input of an NFET transistor M3 216. The transistor M3 216 also receives the perception enable signal RX 225, as a control signal.
    [0031] The outputs from transistors 212 Ml and M2 214 are also applied to a programmable delay circuit 224 and to an NFET transistor M4 220. A switch SI 222 controls the output application for both programmable delay circuit 224 and the transistor M4 220. Switch SI 222 is controlled by an inverse of the perception enable signal RX 225 (inverted by an inverter 218). The reverse of the perception enable signal RX 225 is also applied as a control signal for transistor M4 220. Programmable delay circuit 224 generates a detection signal 227, which indicates whether any of the signals 241, 242 are active. In an illustrative embodiment, the detection signal 227 is the detection signal 113 of figure 1.
    [0032] It should be noted that the programmable delay circuit 224 may include a Schmitt driver 226. The Schmitt driver 226 can be activated after an initial stabilization time of the RX 200 sense circuit, so that the detection signal 227 changes state after the heatsink device capacitors 236-238 are discharged. For example, when heatsink device capacitors 236-238 are coupled to 3.3V power sources, the Schmitt 226 actuator may have a threshold value of approximately 2V.
    [0033] It will be appreciated that the RX 200 sense circuit of figure 2 can enable an HDMI or DVI source device to detect a connection to an HDMI cable or DVI heatsink device, without consuming power from a voltage source in the device. source. For example, the RX 200 sense circuit of Figure 2 can detect a connection to an HDMI or DVI heatsink device, based on signals (for example, signals 241-242) received from the heatsink device, it will be appreciated even though the sense circuit RX 200 of figure 2 can be implemented by adding some transistors, resistors and inverters, to a source device. It will be appreciated, therefore, that an area penalty associated with the sense circuit RX 200 of figure 2 may be small, in relation to the area occupied by a source device.
    [0034] Referring to figure 3, a flow diagram of a particular illustrative embodiment of a power saving method for HPD is described and, in general, designated 300. In an illustrative embodiment, method 300 can be performed by the device 110 of figure 1.
    [0035] Method 300 includes detecting, on a source device that includes a DC voltage source, a connection from the source device to the heatsink device, through a connector, at 302. The connection is detected without consuming power from of the DC voltage source. For example, in figure 1, the sense circuit RX 116 can detect a connection from the source device 110 to the heatsink device 130, through the connector 120, without consuming power from the DC 112 voltage source.
    [0036] Method 300 also includes enabling a connection to the DC voltage source, in response to detecting the connection, at 304. For example, in figure 1, controller 114 can activate a switch coupled to DC voltage source 112.
    [0037] Method 300 also includes receiving an HPD signal, at 306. For example, in figure 1, controller 114 can receive an HPD signal, through the HPD pin 122 of connector 120.
    [0038] Method 300 includes enabling an output trigger on the source device, in response to detecting the HPD signal, at 308. For example, in figure 1, controller 114 can enable output driver 118 via data transfer enable signal 117.
    [0039] It will be appreciated, therefore, that method 300 in figure 3 can allow source devices (for example, HDMI or DVI source devices) to detect a connection to a heatsink device (for example, HDMI heatsink devices or DVI) without consuming power from a source voltage DC source device.
    [0040] Referring to figure 4, a particular illustrative embodiment of a state diagram for implementing a power saving method for HPD in a source device is described and, in general, designated 400. It should be noted that the state diagram 400 is a one-way cyclical state diagram.
    [0041] In state 401, the source device is waiting for a connection to a dissipating device. When the source device is connected to a heatsink device, an RX sense circuit on the source device detects the pin connection of a connector, in state 402. For example, referring to figure 1, when the source device 110 is connected to the heatsink device 130, the sense circuit RX 116 can detect the connection through the signals sent over pins 123-124 of connector 120.
    [0042] When the connection is detected, a source of DC voltage, in the original device, is enabled, in state 403. For example, referring to figure 1, when the sense circuit RX 116 detects the connection, the controller 114 can enable the DC 112 voltage source.
    [0043] After enabling the DC voltage source, an HPD signal can be received, in state 404. For example, referring to figure 1, after controller 114 enables DC voltage source 112, controller 114 can receive an HPD signal via the HPD pin 122 of connector 120.
    [0044] Upon receiving the HPD signal, the RX sense circuit, in the source device, can be disabled, in state 405. For example, referring to figure 1, controller 114 can disable the RX 116 sense circuit, when receiving the HPD signal.
    [0045] After the RX sense circuit is disabled, data transmission from an output driver of the source device can be enabled, in state 406. For example, referring to figure 1, controller 114 can allow data transmission from output driver 118, after receiving the HPD signal.
    [0046] Once the output trigger is active, the source device enters a 407 state and waits for a disconnection of the source device from the heatsink device. When the source device is disconnected from the heatsink device, an absence of the HPD signal, in the source device, is detected, in state 408. For example, referring to figure 1, controller 114 can detect an absence of the HPD signal on the connector's HPD pin 122. In an illustrative embodiment, the absence of the HPD signal is detected by a pull-down circuit of the controller 114, which is coupled to the HPD pin 122.
    [0047] After detecting the absence of the HPD signal, the DC voltage source, in the source device, can be disabled, in state 409. For example, referring to figure 1, controller 114 can disable the source of DC voltage 112.
    [0048] The output driver of the source device can also be disabled, in state 410. For example, referring to figure 1, the controller 114 can disable the data transfer in the output driver 118.
    [0049] After the output driver is disabled, the RX sense circuit, in the source device, is enabled, in state 411. For example, referring to figure 1, the controller can enable the RX sense circuit 116 Once the RX sense circuit is enabled, the source device returns to state 401 and waits for another connection from the source device to the heatsink device. Alternatively, the RX sense circuit on the source device can remain disabled until an application is enabled on the source device that uses HD output.
    [0050] It should be noted that state diagram 400, shown in figure 4, represents an illustrative modality of a power saving method for HPD. Thus, the order of several states can be interchanged, while keeping the power savings for HPD intact. For example, the order of states 405-406 can be interchanged. As another example, the order of states 409-411 can be interchanged.
    [0051] Referring to figure 5, a block diagram, of a particular illustrative modality of an electronic device that includes power saving for HPD, is described and, in general, designated 500. The device 500 includes a processor, such as as a digital signal processor (DSP) 510, coupled to a memory 532. Figure 5 also shows a display controller 526, which is coupled to the digital signal processor 510 and a display 528. An encoder / decoder (CODEC) 534 can also be coupled to the digital signal processor 510. A speaker 536 and a microphone 538 can be coupled to CODEC 534.
    [0052] The device 500 also includes a DC voltage source of + 5V 550 and an HDMI 560 circuit, coupled to the DSP 510. The HDMI 560 circuit includes a controller 561, a sense circuit RX 562 and an output driver 563. The HDMI 560 circuit includes an HDMI interface comprising a 564 power supply pin (for example, a DC interface), an HPD 565 pin, a 566 clock pin, a + 567 clock pin, a data pin. 568 and a data pin + 569. In an illustrative embodiment, the voltage source DC + 5V 550 is the voltage source DC 112 in figure 1, controller 561 is controller 114 in figure 1, the sense circuit RX 562 is the sense circuit RX 116 of figure 1, and the output driver 563 is the output driver 118 of figure 1. In a particular embodiment, the 560 HDMI circuit is turned on when the DSP 510 starts an HD application on device 500 and turned off when the DSP 510 turns off the HD app on the 500 device.
    [0053] Figure 5 also indicates that a wireless controller 540 can be coupled to the digital signal processor 510 and a wireless antenna 542. In a particular embodiment, DSP 510, display controller 526, memory 532, the CODEC 534, the wireless controller 540, the DC voltage source of + 5V 560 and the HDMI 560 circuit are included in a system-in-package or system-in-chip device 522. In a particular embodiment, a device input 530 and a power supply 544 are coupled to the system-on-chip device 522. In addition, in a particular embodiment, as shown in figure 5, the display 528, the input device 530, the speaker 536 , microphone 538, wireless antenna 542 and power supply 544 are external to system-on-chip device 522. However, each of the display 528, input device 530, speaker 536, microphone 538, wireless antenna 542 and power supply 544 can be coupled to a component and the system-on-chip device 522, such as an interface or a controller.
    [0054] Figure 6 represents a particular illustrative embodiment of an electronic device manufacturing process 600. For example, the electronic device manufacturing process can be used to manufacture power saving elements for HPD, as described here with reference to figures 1-5 (for example, system components in figure 1 or the circuit in figure 2). Physical device information 602 is received in manufacturing process 600, such as on a survey computer 606. Physical device information 602 can include design information that represents at least one physical power-saving property for HPD, such as elements power savings for HPD, as described here with reference to figures 1-5. For example, information from physical device 602 can include physical parameters, material characteristics and structure information that are entered through a user interface 604, coupled to the research computer 606. The research computer 606 includes a processor 608, such as as one or more processing cores, coupled to a computer-readable medium, such as a 610 memory. Memory 610 can store computer-readable instructions that are executable to cause processor 608 to transform physical device information 602 to be compatible with a file format and to generate a 612 file library.
    [0055] In a particular embodiment, the 612 file library includes at least one data file, including the transformed design information. For example, library file 612 may include a library of semiconductor devices, including one or more system components in Figure 1 or the circuit in Figure 2, which is provided for use with an electronic design automation tool (EDA) 620 .
    [0056] The library file 612 can be used in conjunction with the EDA 620 tool on a 614 design computer, including a 616 processor, such as one or more processing cores, coupled to a 618 memory. The EDA 620 tool can be stored as executable processor instructions, in memory 618, to allow a user of the project computer 614 to design a circuit, using one or more system components in figure 1 or the circuit in figure 2, from the 612 file library. For example, a user of design computer 614 can enter circuit design information 622, via a user interface 624, coupled to design computer 614. Design information for circuit 622 can include design information that represents at least one physical property of a semiconductor device, such as one or more components of the system of figure 1 or the circuit of figure 2. To illustrate, the design property of circuit p It may include identification of particular circuits and relationships with other elements in a circuit design, positioning information, resource size information, interconnection information or other information that represents a physical property of a semiconductor device.
    [0057] The design computer 614 can be configured to transform design information, including circuit design information 622, to be compatible with a file format. To illustrate, the file format can include a binary database file format, representing flat geometric shapes, text labels and other information about a circuit layout in a hierarchical format, such as a Data System file format Chart (GDSII). The design computer 614 can be configured to generate a data file, including the transformed design information, such as a GDSII 626 file, which includes information describing one or more components of the system in figure 1 or the circuit in figure 2, in addition to other circuits or information. To illustrate, the GDSII 626 file may include information corresponding to a system-on-chip (SOC) that includes one or more components of the system in figure 1 or the circuit in figure 2, and that also includes other electronic circuits and components within the SOC.
    [0058] The GDSII file 626 can be received in a manufacturing process 628, to manufacture one or more components of the system of figure 1 or the circuit of figure 2, according to information transformed in the GDSII file 626. For example, a process device manufacturing may include providing the GDSII file 626 to a mask maker 630 to create one or more masks, such as masks to be used for photolithography processing, illustrated as a representative mask 632. Mask 632 can be used during the manufacturing process for generating one or more wafers 634, which can be tested and separated into tablets, such as a representative tablet 636. The tablet 636 includes a circuit, which includes one or more components of the system of figure 1 or the circuit of the figure 2.
    [0059] The tablet 636 can be supplied to a packaging process 638, wherein the tablet 636 is incorporated into a representative package 640. For example, the package 640 can include the single tablet 636 or multiple tablets, such as an arrangement of system-in-packet (SIP). The 640 package can be configured to be compatible with one or more standards or specifications, such as Joint Council for Electron Device Engineering (JEDEC) standards.
    [0060] Information regarding the 640 package can be distributed to various product designers, such as through a component library, stored on a 64 computer 6. The 64 computer can include a 648 processor, such as one or more cores processors, coupled with a 650 memory. A printed circuit board (PCB) tool can be stored as executable processor instructions, in the 650 memory, to process PCB 642 design information received from a 646 computer user, via a 644 user interface. The PCB 642 design information may include physical positioning information for a semiconductor device packaged on a circuit board, the packaged semiconductor device corresponding to package 640, including one or more system components of figure 1 or the circuit of figure 2.
    [0061] Computer 646 can be configured to transform PCB 642 design information to generate a data file, such as a GERBER 652 file, with data that includes physical positioning information for a semiconductor device packaged on a circuit board, as well as layout of electrical connections, such as lines and tracks, in which the packaged semiconductor device corresponds to package 640, including one or more components of the system of figure 1 or the circuit of figure 2. In other modalities, the data file generated by the transformed PCB design information can have a different format than a GERBER format.
    [0062] The GERBER 652 file can be received in a 654 board assembly process and used to create PCBs, such as a representative 656 PCB, manufactured according to design information, stored within the GERBER 652 file. For example, the GERBER 652 file can be loaded onto one or more machines to perform several steps in a PCB production process. PCB 656 can be filled with electronic components, including package 640, to form a representative printed circuit (PCA) 658 assembly.
    [0063] PCA 658 can be received in a 660 product manufacturing process and integrated into one or more electronic devices, such as a first representative electronic device 662 and a second representative electronic device 664. As an illustrative, non-limiting example, the first representative electronic device 662, the second representative electronic device 664 or both can be selected from the group of a set top box, a music player, a video player, an entertainment unit, a navigation device, a device communication and a computer. As another illustrative, non-limiting example, one or more of the electronic devices, 662 and 664, can be remote units, such as mobile phones, portable personal communication systems (PCS) units, portable data units, such as personal data assistants. data, global positioning system (GPS) enabled devices, navigation devices, fixed location data units, such as meter measurement equipment or any other device that stores or retrieves data or computer instructions, or any combination thereof.
    [0064] Thus, one or more components of the system of figure 1 or the circuit of figure 2 can be manufactured, processed and incorporated in an electronic device, as described in illustrative process 600. One or more aspects of the embodiments disclosed with respect to figures 1-5 can be included in various processing steps, such as within library file 612, file GDSII 626 and file GERBER 652, as well as stored in memory 610 of the research computer 606, in memory 618 of the research computer project 614, in the memory 650 of the computer 64 6, in the memory of one or more other computers or processors (not shown), used in the various stages, such as in the 654 board assembly process, and also incorporated in one or more other modalities physical, such as mask 632, insert 636, package 640, PCA 658, other products, such as prototype circuits or devices (not shown), or any combination thereof. Although the various representative production steps, from a physical device design to a final product, are represented. In other modalities, fewer steps can be used, or additional steps can be included. Likewise, process 600 can be performed by a single entity or by one or more entities that carry out different stages of process 600.
    [0065] Those experts would also appreciate that the various illustrative logic blocks, configurations, modules, circuits and algorithm steps, described in connection with the modalities disclosed here, can be implemented as electronic hardware, computer software or combinations of both. To clearly illustrate this interchangeability of hardware and software, several components, blocks, modules, circuits and steps, illustrative, have been described above in terms, in general, of their functionality. Whether these elements are implemented as hardware or software depends on the particular application and design restrictions imposed on the general system. Qualified craftsmen can implement the functionality described, in different ways, for each specific application, but such implementation decisions should not be interpreted as a cause for departing from the scope of the present disclosure.
    [0066] In addition, the steps and / or actions of a method or algorithm described in connection with the aspects described here can be incorporated directly into hardware, a software module executed by a processor or a combination of the two. A software module can reside in random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), programmable read-only memory electrically erasable (EEPROM), registers, hard disk, a removable disk, a compact disc read-only memory (CD-ROM) or any other form of storage media known in the art. An exemplary storage medium can be coupled to the processor, such that the processor can read information from, and write information to, the storage medium. Alternatively, the storage medium can be integral to the processor. The processor and the storage medium can reside in an application specific integrated circuit (ASIC). The ASIC can reside on a computing device or on a user terminal. Alternatively, the processor and storage medium can reside as discrete components in a computing device or user terminal.
    [0067] The foregoing description of the disclosed modalities is provided to allow anyone skilled in the art to make or use the disclosed modalities. Various modifications to these modalities will be readily apparent to those skilled in the art, and the principles defined herein can be applied to other modalities without departing from the scope of the disclosure. Thus, the present disclosure is not intended to be limited to the modalities shown here, but it is to be granted the widest possible scope 28/28, consistent with the new principles and features, as defined in the following claims.
    权利要求:
    Claims (15)
    [0001]
    1. Apparatus (100; 500) for saving power to detect hot plug comprising: means (121; 564) for supplying a direct current (DC) voltage; means (116; 562) for detecting a connection from the apparatus to a heatsink device (130), coupled to the apparatus without consuming power from a DC voltage source within the apparatus; means (114) for receiving a detection signal (113) from the means for detecting the connection, in response to detecting the dissipating device being coupled to the apparatus; means (111) for selectively enabling and disabling a connection to the means for supplying the DC voltage source; means (114) for detecting the presence of a hot plug detection (HPD) signal; the apparatus characterized by the fact that it additionally comprises: means (115) for disabling the means for detecting the connection when the presence of the HPD signal is detected.
    [0002]
    2. Apparatus (100; 500) according to claim 1, characterized by the fact that it further comprises: means (114) for detecting an absence of the HPD signal at the HPD interface; and means for enabling the means for detecting the connection when the absence of the HPD signal is detected.
    [0003]
    Apparatus (100; 500) according to claim 1, characterized in that the means for supplying the DC voltage source provide a DC voltage of approximately five volts.
    [0004]
    4. Apparatus (100; 500) according to claim 1, characterized by the fact that it additionally comprises means (118) for output driver, in which means to control are configured to enable data transmission in the means for output driver in response to detecting the HPD signal.
    [0005]
    5. Apparatus (100; 500), according to claim 4, characterized by the fact that the means for detecting the connection and the means for output driver are each coupled to connector pins (120), and in that the means for detecting the connection detect the dissipating device (130) being coupled to the apparatus by detecting a signal sent through the pins.
    [0006]
    6. Apparatus (100; 500), according to claim 1, characterized by the fact that the dissipating device (130) is coupled to the apparatus via a high definition multimedia interface (HDMI) or a digital visual interface connector ( DVI).
    [0007]
    Apparatus (100; 500) according to claim 1, characterized by the fact that the HPD signal is received from the heatsink device (130) in the apparatus through the HPD interface, in response to the apparatus supplying a voltage DC from the DC voltage source to the heatsink device, via the DC interface.
    [0008]
    8. Apparatus according to claim 1, characterized by the fact that it is integrated with at least one semiconductor wafer.
    [0009]
    9. Power-saving method for detecting hot plug comprising: detecting, in a source device (100; 500), a connection that the source device is coupled to a heatsink device (130), through a connector (120) on the source device, based, at least in part, on a first signal received from the heatsink device, where the first signal received from the heatsink device is received before the source device communicates with the heatsink device without consuming power from a DC voltage source (112; 550) of the source device; enable a direct current (DC) voltage source (112; 550) from the source device in response to the detection that the source device is coupled to the heatsink connection; detect a hot plug detection signal through an HPD pin (122; 565) on the connector; the method characterized by the fact that it additionally comprises: disabling a receiver (116) of the first signal in response to the HPD signal being detected.
    [0010]
    10. Method according to claim 9, characterized by the fact that the connection through which the dissipating device (130) is coupled to the original device (100; 500) is detected in a receiver perception circuit (116) coupled to an output driver (118) of the source device, where the receiver perception circuit and the output driver are each coupled to connector pins (120).
    [0011]
    11. Method, according to claim 10, characterized by the fact that the pins (123, 124, 125, 126) are configured to transmit and receive transition minimized differential signaling data (TMDS).
    [0012]
    12. Method, according to claim 10, characterized by the fact that the controller (114) responsive to the receiver perception circuit (116) disables the connection to the DC voltage source (112; 550) through the switch in response to the detection of an absence of the HPD signal.
    [0013]
    13. Method, according to claim 12, characterized by the fact that the absence of the HPD signal is caused by disconnection of the source device (100; 500) and / or the dissipating device (130) not being coupled from the connector (120).
    [0014]
    14. Method according to claim 9, characterized by the fact that the dissipating device (130) is a display device, and in which the signal received from the dissipating device is a clock signal.
    [0015]
    15. Method according to claim 9, characterized by the fact that the source device (100; 500) is a wireless electronic device powered by a battery, and in which the DC voltage source (112; 550) is in a power-saving state to save battery life when the heatsink device (130) being attached to the source device connection is detected, where the power-saving state includes the source device in an inactive state, a standby or a non-high definition output state.
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    JP2013507692A|2013-03-04|
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    EP2486468A1|2012-08-15|
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    法律状态:
    2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-07-30| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-05-26| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2020-10-13| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 13/10/2020, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
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    US12/575,498|US8674679B2|2009-10-08|2009-10-08|Power saving during a connection detection|
    US12/575,498|2009-10-08|
    PCT/US2010/051863|WO2011044388A1|2009-10-08|2010-10-07|Power saving for hot plug detect|
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